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74HC138 1-of-8 Decoder/ Demultiplexer
High-Performance Silicon-Gate CMOS
The 74HC138 is identical in pinout to the LS138. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC138 decodes a three-bit Address to one-of-eight active-low outputs. This device features three Chip Select inputs, two active-low and one active-high to facilitate the demultiplexing, cascading, and chip-selecting functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output; one of the Chip Selects is used as a data input while the other Chip Selects are held in their active states.
Features http://onsemi.com MARKING DIAGRAMS
16 16 1 SOIC-16 D SUFFIX CASE 751B 1 16 16 1 TSSOP-16 DT SUFFIX CASE 948F 1 HC138 = Device Code A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) HC 138 ALYW G G HC138G AWLYWW
* * * * * * * * *
Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A ESD Performance: HBM > 2000 V; Machine Model > 200 V Chip Complexity: 100 FETs or 29 Equivalent Gates These are Pb-Free Devices
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2007
March, 2007 - Rev. 1
1
Publication Order Number: 74HC138/D
74HC138
A0 A1 A2 1 2 3 15 Y0 14 Y1 13 Y2 12 Y3 11 Y4 10 Y5 9 Y6 7 Y7
A0 A1 A2 CS2 CS3 CS1 Y7 GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6
ADDRESS INPUTS
ACTIVE-LOW OUTPUTS
Figure 1. Pin Assignment
CHIP- SELECT INPUTS
CS1 CS2 CS3
6 4 5 PIN 16 = VCC PIN 8 = GND
Figure 2. Logic Diagram FUNCTION TABLE
Inputs X X L H H H H H H H H X H X L L L L L L L L H X X L L L L L L L L X X X L L L L H H H H X X X L L H H L L H H X X X L H L H L H L H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H Outputs H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
H = high level (steady state); L = low level (steady state); X = don't care
ORDERING INFORMATION
Device 74HC138DR2G 74HC138DTR2G Package SOIC-16 (Pb-Free) TSSOP-16* Shipping 2500 / Tape & Reel 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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74HC138
IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS
Symbol VCC Vin Iin Iout ICC PD Tstg TL Vout Parameter Value Unit V V V mA mA mA mW _C _C 260 DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 25 50 500 450 - 65 to + 150 DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (SOIC or TSSOP Package) SOIC Package TSSOP Package
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Derating - SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 .W/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Vin, Vout TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 2) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Min 2.0 0 - 55 0 0 0 Max 6.0 VCC + 125 1000 500 400 Unit V V _C ns
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74HC138
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol VIH Parameter Minimum High-Level Input Voltage Test Conditions Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA VCC (V) 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 Guaranteed Limit -55_C to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.48 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.26 0.1 4 v 85_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.34 3.84 5.34 0.1 0.1 0.1 0.33 0.33 0.33 1.0 40 v 125_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.20 3.70 5.20 0.1 0.1 0.1 0.40 0.40 0.40 1.0 40 mA mA V Unit V
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA
V
VOH
Minimum High-Level Output Voltage
Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA
V
VOL
Maximum Low-Level Output Voltage
Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA
Iin ICC
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND Vin = VCC or GND Iout = 0 mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input A to Output Y (Figures 1 and 4) VCC (V) 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 - Guaranteed Limit -55_C to 25_C 135 90 27 23 110 85 22 19 120 90 24 20 75 30 15 13 10 v 85_C 170 125 34 29 140 100 28 24 150 120 30 26 95 40 19 16 10 v 125_C 205 165 41 35 165 125 33 28 180 150 36 31 110 55 22 19 10 Unit ns
tPLH, tPHL
Maximum Propagation Delay, CS1 to Output Y (Figures 2 and 4)
ns
tPLH, tPHL
Maximum Propagation Delay, CS2 or CS3 to Output Y (Figures 3 and 4)
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output (Figures 2 and 4)
ns
Cin
Maximum Input Capacitance
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Package)* 55 pF * Used to determine the no-load dynamic power consumption: PD = CPD VCC2 f + ICC VCC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
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74HC138
SWITCHING WAVEFORMS
VALID INPUT A tPLH OUTPUT Y 50% 50% tPHL OUTPUT Y tTHL VALID VCC GND INPUT CS1 tPHL tr 90% 50% 10% 90% 50% 10% tf VCC tPLH GND
tTLH
Figure 1.
Figure 2.
TEST POINT tf INPUT CS2, CS3 90% 50% 10% tr VCC tPLH GND DEVICE UNDER TEST OUTPUT C L*
OUTPUT Y
90% 50% 10%
tPHL
tTHL
tTLH
*Includes all probe and jig capacitance
Figure 3.
Figure 4. Test Circuit
PIN DESCRIPTIONS
ADDRESS INPUTS A0, A1, A2 (Pins 1, 2, 3)
Address inputs. For any other combination of CS1, CS2, and CS3, the outputs are at a logic high.
OUTPUTS Y0 - Y7 (Pins 15, 14, 13, 12, 11, 10, 9, 7)
Address inputs. These inputs, when the chip is selected, determine which of the eight outputs is active-low.
CONTROL INPUTS CS1, CS2, CS3 (Pins 6, 4, 5)
Chip select inputs. For CS1 at a high level and CS2, CS3 at a low level, the chip is selected and the outputs follow the
Active-low Decoded outputs. These outputs assume a low level when addressed and the chip is selected. These outputs remain high when not addressed or the chip is not selected.
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74HC138
EXPANDED LOGIC DIAGRAM
15
Y0
14
Y1
A0
1
13
Y2
A1
2
12
Y3
A2
3
11
Y4
10 CS3 CS2 5 4 9
Y5
Y6
7
Y7
CS1
6
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74HC138
PACKAGE DIMENSIONS
SOIC-16 CASE 751B-05 ISSUE K
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
SOLDERING FOOTPRINT*
6.40
16X 8X
1.12 16
1
16X
0.58
1.27 PITCH 8 9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC138
PACKAGE DIMENSIONS
TSSOP-16 CASE 948F-01 ISSUE B
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K
2X
L/2
16
9
J1 B -U-
SECTION N-N J N
L
PIN 1 IDENT. 1 8
0.15 (0.006) T U
S
A -V-
N F DETAIL E
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
0.36
16X
16X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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CCC EEE CCC EEE CCC
0.25 (0.010) M
K1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
0.65 PITCH
DIMENSIONS: MILLIMETERS
74HC138
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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74HC138/D

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